- DM03/04 Series conforms to JEDEC standards
- Memory Module Board is retained in the socket by metal latches.
- Easy insertion and withdrawal of Memory Module Board.
- Metal latches are highly reliable
- TSOP DRAM or other components can be mounted beneath DM03/04 socket
- RoHS compliance
DM03/04 Series
SO-DIMM Socket
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The DM03/04 Series of connectors is used for internal-memory expansion in small mobile devices such as laptop computers. Compliant with JEDEC standards, these sockets are extremely easy to use. Features
Specifications
| Insulator material | Glass-filled LCP (UL94V-0) |
|---|---|
| Contact material | Copper alloy |
| Contact plating | Gold over Nickel |
| Latch material | Copper alloy |
| Latch plating | Tin copper over Nickel |
| Current rating | 0.5A per contact |
| Contact resistance | 50mΩ max. |
| Withstanding voltage | 250V AC for 1 minute |
| Insulation resistance | 500MΩ min. at 250V DC |
| Operating Temperature | -55°C to +85°C |
