SIC01 Series
1.778mm Pitch Shrink IC Socket
The SIC01 Series of shrink-type IC sockets feature a solder-intake prevention design that uses the same contact concept as successfully employed in the ICC05 Series, and through the use of a new preload method, realizes higher levels of contact stability and reliability. As a result, these sockets are extremely easy to use.
Features
- Shrink-type IC socket with a 70 mil/1.778 mm lead pitch for shrink dual-in-line package (SDIP) applications.
- Highly-reliable design with two-sided contact and preload configuration in order to assure stable, consistent connections.
- Supports board hole diameters of 0.6 mm minimum in order to facilitate densely-packed patterns.
- Low profile design (4.6mm)
- Closed-bottom design to prevent the intake of solder.
- Skeleton variations are also available (64-contact type only)
- RoHS compliance
Specifications
| Insulator material | Glass-filled P.B.T. (UL94V-0) |
|---|---|
| Contact material | Copper alloy |
| Contact plating | 361TX-F ; Pure tin over Nickel 361G; Gold over Nickel |
| Current rating | 1A per contact |
| Contact resistance | 20mΩ max. |
| Dielectric withstanding voltage | 800V AC for 1minute |
| Insulation resistance | 5,000MΩ min. at 500V DC |
| Insertion force | 454g max./pin |
| Withdrawal force | 14.17g max./pin |
| Operating Temperature | -20°C ~+70°C |
