The 89 Series of low-profile, half-pitch connectors utilizes the concept of securely-fit, one-point contacts. Having the most compact design and lowest profile of all KEL half-pitch connectors, and also featuring a guide mechanism, this product is ideal for SMT applications.
The connectors of the 8900 Series have become the de facto standard for removable-media applications as used in laptop computers. Furthermore, the right-angle variation provides three rows of tail contacts in order to facilitate high-density mounting.
With five variations of stacking height between 7 and 12 mm, and eight variations of contact numbers between 20 and 120, these connectors support application in a diverse range of situations. Naturally, connections can be made in three dimensions in the form of stacking, vertical mounting, and horizontal mounting.

Insulator material	Glass-filled PPS (UL 94V-0), Brown Alignment plate : Glass-filled Nylon 66 (UL 94V-0), Brown
Contact material	Copper alloy
Contact plating	Contact area ; Gold over Nickel Terminal area ; Tin copper over Nickel (Receptacle) Gold over Nickel (Plug)
Current rating	0.5A per contact
Contact resistance	40mΩ max.
Dielectric withstanding voltage	650V AC for 1 minute
Insulation resistance	1,000MΩ min. at 500V DC
Insertion force	1.9kg max. / 20 pin, 3.8kg max. / 40 pin, 5.7kg max. / 60 pin, 9.5kg max. / 100 pin
Withdrawal force	0.3kg min. / 20 pin, 0.6kg min. / 40 pin, 0.9kg min. / 60 pin, 1.5kg min. / 100 pin